Wafer and Cookie Grinding Machine
Specifications
Wafer and Cookie Grinding MachineThe machine used for milling wafer and biscuit into power,then recycling and reused
Wafer and Cookie Grinding Machine
This machine is a kind of supplementary equipment and utilized for waste recycling.
Material: the machine frame is made of steel with international standard, and adopts imported 304 stainless steel plate with thickness of 3mm
Blade speed:1420rpm
NAME |
POWER (kw) |
WEIGHT (kg) |
SIZE (MM) |
Biscuit and wafter grinder |
1.1 |
150 |
900*700*900 |
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