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Home > Manufacturing & Processing Machinery > Laser Equipment > Laser Cutting Machine > UV Laser Wafer Scribing System()

UV Laser Wafer Scribing System()

Negotiable MOQ: 1 set (Price negotiable depending on order volume and customization)

Key Specifications

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Laser Type:

Semiconductor

Place of Origin:

China

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Suzhou Everich Imp. & Exp. Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

Delivery time depends on order quantity.

Product Details
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Laser Type Semiconductor

Place of Origin China

Specifications

specifically to support LED chip manufacturing. Substrates, such as Sapphire, Copper, Silicon, Cobalt as well as Alloy

It specifically to support LED chip manufacturing. Substrates, such as Sapphire, Copper, Silicon, Cobalt as well as Alloy, can be scribed with high precision. This system has a very good quality and can achieve high throughput(10 pcs/hr) with long time reliabiltiy. UltraScriber has won much good reputation among customers, and is accepted widely in the LED industrial.

TripleScriber is another UV laser scribing system which is sepecially developed for scribing small size chips with high throughput.

Features
• 4 Dimentional high precision adjust system for position
• 3 Co-Axial CCD image indentifying system
• Real-time monitoring for laser power
• Powerful vision system for anti-roughness on chip surface
• High stability shock-proof system with granite
• Process memory system

Application Materials
Sapphire, Ceramic, Quartz, Diamond, Silicon as well as Copper, Cobalt, and many Alloys

Applications
LED and other wafer production industries

Specifications                    UltraScriber / TripleScriber
Chip Size                             ≥ 6 mil
Scribing Depth                   22-45 um
Beam Number                   Single / Three
Rotation Stage                   ±7°with 0.0001°Res.
X-Y axis resolution             0.1 um
Z axis resolution                1 um
Throughput                         > 15pcs/h @ 14 mil