AMK325LAV23GMAMD CPU BGA Chip Hot Spot Inventory
AMD Athlon II Neo K325 specifications
| General information | |
| Type | CPU / Microprocessor |
| Market segment | Mobile |
| Family | AMD Athlon II Neo Dual-Core Mobile |
| Model number ? | K325 |
| CPU part number |
|
| Stepping code | AAEGC AE |
| Frequency ? | 1300 MHz |
| Bus speed ? | One 1000 MHz 16-bit HyperTransport link (2 GT/s) |
| Clock multiplier ? | 6.5 |
| Package | 812-ball ASB2 BGA |
| AMD Package number | 30532 |
| Socket | BGA812 |
| Size | 1.06" x 1.06" / 2.7cm x 2.7cm |
| Introduction date | May 12, 2010 |
| End-of-Life date | Last order date is end of 1st quarter 2011 [1] |
| Architecture / Microarchitecture | |
| Microarchitecture | K10 |
| Platform | Nile |
| Processor core ? | Geneva |
| Core stepping ? | DA-C3 |
| CPUID | 100F63 |
| Manufacturing process | 0.045 micron silicon-on-insulator (SOI) technology |
| Data width | 64 bit |
| The number of cores | 2 |
| The number of threads | 2 |
| Floating Point Unit | Integrated, 64-bit wide |
| Level 1 cache size ? | 2 x 64 KB 2-way set associative instruction caches 2 x 64 KB 2-way set associative data caches |
| Level 2 cache size ? | 2 x 1 MB 16-way set associative caches |
| Level 3 cache size | None |
| Multiprocessing | Uniprocessor |
| Features |
|
| Low power features | PowerNow! |
| Integrated peripherals / components | |
| Integrated graphics | None |
| Memory controller | The number of controllers: 1 Memory channels: 2 Supported memory: DDR3-800, DDR3L-800 Maximum memory bandwidth (GB/s): 12.8 |
| Other peripherals | HyperTransport technology 3.0 |
| Electrical / Thermal parameters | |
| Thermal Design Power ? | 12 Watt |
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