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Help CenterFO 800MESH Lapping Powder Similar FUJIMI
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FO 1000/1200/1500 Polishing Silicon WafersUS$ 16.9 - 29.9MOQ: 1000 Kilograms -
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FO 800MESH lapping powder similar FUJIMI
Physical properties and Chemical composition of FO 800MESH lapping powder similar FUJIMI
Item |
Size |
Specific Gravity |
Al2O3 |
SiO2 |
Fe2O3 |
TiO2 |
ZrO2 |
FO |
800# |
≥3.90 |
≥45.0% |
≤20.0% |
≤0.5% |
≤2.0% |
≤33.0% |
PSD(Particle Size Distribution) of FO 800MESH lapping powder similar FUJIMI
Size |
D0 |
D3 |
D50 |
D94 |
#800 |
≤32.0 |
≤27.0 |
11.3±0.9 |
≥6.5 |
FO lapping powder Main Applications
--Grinding and polishing of semiconductor wafers
--Surface finishing of various optical glasses
--Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
--Surface finishing of piezoelectric materials
Packing of lapping powder
10kgs PVC bags+pallet
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