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Home > Electrical & Electronics > Telecommunication & Broadcasting > Satellite > 0.8–18 GHz Mini Single-Channel RF Upconverter Module

0.8–18 GHz Mini Single-Channel RF Upconverter Module

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Negotiable MOQ: 1 Combo (Price negotiable depending on order volume and customization)

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Location:

Shenzhen, Guangdong, China

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Shenzhen Huashi Digital Technology Co., Ltd.

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SHENZHEN HUASHI DIGITAL TECHNOLOGY CO., LTD.

0.8–18 GHz Mini Single-Channel RF Upconverter Module

Surface-Mount Two-Stage Conversion · IF 1.8 GHz · RF 0.8–18 GHz

0.8–18 GHz Mini Single-Channel RF Upconverter Module

IF 1.8 GHz / BW ≥1 GHz · RF Output 0.8–18 GHz · Receive Gain 50 dB ±1.5 dB · Independent RF/IF Digital Attenuation

IF Center Frequency	RF Output Frequency	Receive Gain	RF Digital Attenuation
1.8 GHz	0.8 – 18 GHz	50 dB ±1.5 dB	0 – 31 dB

1. Product Overview

The 0.8–18 GHz mini single-channel RF upconverter module adopts a surface-mount two-stage conversion architecture. It up-converts an IF signal with a 1.8 GHz center frequency and 1 GHz bandwidth into outputs covering both a 0.01–2 GHz low-power port and a 0.8–18 GHz RF port. The RF output is capable of directly driving a power amplifier, so no separate driver stage is required. Equipped with detachable SMP-J connectors, the module combines a highly integrated, miniaturized design with easy assembly and field maintenance. It provides 50 dB ±1.5 dB receive gain, independent digital attenuation for the RF and IF paths (1 dB and 0.5 dB steps respectively), and two switchable dual-LO schemes to match a wide range of RF test scenarios. With a compact outline and complete frequency-conversion control functions, it is widely applied in RF R&D and system integration projects.

2. Key Features

1. Two-stage conversion, wide coverage: a surface-mount two-stage chain covers the full 0.8–18 GHz range in one signal path, balancing in-band flatness against spurious suppression.

2. RF output drives power amplifiers directly: the RF port has sufficient output level to feed a power amplifier, simplifying the transmit chain and reducing overall size and cost.

3. Stable gain, fine attenuation control: receive gain of 50 dB ±1.5 dB; RF path 0–31 dB (1 dB step) and IF path 0–31.5 dB (0.5 dB step), independently adjusted for precise dynamic-range configuration.

4. Two selectable dual-LO schemes: two switchable dual-LO configurations adapt to different frequency-synthesis resources, spurious requirements and test scenarios.

5. Miniaturized and highly integrated: surface-mount package with a compact outline and detachable SMP-J connectors, easy to embed in tight chassis, portable test equipment and array systems.

3. Specifications

3.1 Frequency & Ports

Parameter	Specification
IF Input Center Frequency	1.8 GHz
IF Bandwidth	≥ 1 GHz (1 GHz typical)
RF Output Frequency	0.8 – 18 GHz
Low Power Port Output	0.01 – 2 GHz
RF Output Capability	Directly drives power amplifiers
RF Connector	Detachable SMP-J connectors
Configuration	Surface-mount (SMT) two-stage conversion, miniaturized high-integration design

3.2 LO Input (Dual Options)

Parameter	Specification
1st LO Input (Option 1)	20.2 GHz or 23.8 GHz, switchable or single-frequency operation
2nd LO Input (Option 1)	11 – 20 GHz
1st LO Input (Option 2)	11.4 – 20 GHz
2nd LO Input (Option 2)	20.2 GHz / 23.8 GHz
Option Selection	Option 1 or Option 2 defined at ordering; customizable per project

3.3 Gain & Attenuation Control

Parameter	Specification
Receive Gain	50 dB ± 1.5 dB
RF Digital Attenuation	0 – 31 dB, 1 dB step
IF Digital Attenuation	0 – 31.5 dB, 0.5 dB step
Control	On-board digital control; RF and IF paths configured independently

4. Block Diagram

IF input (1.8 GHz / ≥1 GHz) → IF digital attenuator → two-stage mixing (LO1 / LO2) → RF digital attenuator → RF output (0.8–18 GHz) and low power port (0.01–2 GHz)

Note: the diagram above illustrates signal flow and functional composition only, showing how the two-stage conversion chain relates to the two outputs. Actual module configuration, connector types and outline dimensions are subject to the product datasheet.

5. Applications

R&D and Test	Systems and Integration
RF R&D and validation test benches	Satellite communication and microwave system integration
Broadband signal sources / transmit chain build-up	PA driver stages and front-end link prototypes
RF front ends for automated test equipment (ATE)	Embedding in compact and portable RF equipment

6. Ordering & Customization

1. LO scheme: Option 1 (1st LO 20.2 / 23.8 GHz, 2nd LO 11–20 GHz) or Option 2 (1st LO 11.4–20 GHz, 2nd LO 20.2 / 23.8 GHz). Please specify the option when ordering.

2. Connector types (SMP-J and others), outline dimensions, frequency plan, gain and attenuation configuration, and control interface protocol can all be customized to project requirements.

3. Product datasheet, factory test report and integration support are provided. Sample evaluation and volume supply are available; lead time and pricing are subject to a formal quotation.

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