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M6000 Multifunctional Bonder/Ball and Wedge Wirebonders
Negotiable
MOQ: 1 Set (Price negotiable depending on order volume and customization)
Key Specifications
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Model:
M6000
Functional Modes:
ball welding and wedge welding
Thermostat:
220VAC 50/60Hz
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
Delivery time depends on order quantity.
Related Products
Model
M6000
Functional Modes
ball welding and wedge welding
Thermostat
220VAC 50/60Hz
Clamping Table
3″ non-slotted countertop with clips
Microscope
15X magnification
Origin
China
M6000 Multifunctional Bonder
M6000 multifunctional bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.
M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure control, high bonding accuracy; integrated design of the whole machine,compact structure, good user experience.
Equipment application fields
M6000 multifunctional wire bonder is widely used in microwave devices, hybrid circuits, RF devices/modules, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices,etc.
Main parameters
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Main Markets
Southeast Asia, Eastern Asia, South Asia
Location
Wuhan, Hubei, China
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