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Help CenterOne-stop PCBA Assembly Service | SMT Precision Mounting & DIP Wave Soldering for Industrial Smart Equipment, New Energy Controller Pcba
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China Chaosheng Group | Intelligent Device PCBA, SMT, DIP Production Quality Technology
1、 A complete introduction to quality and technology (official website/brochure/final version available for bidding)
（1） Enterprise positioning
China Chaosheng Group provides one-stop PCB bare board self-developed+PCBA whole board assembly intelligent manufacturing services, focusing on high reliability circuit boards such as industrial intelligent equipment, new energy electronic control, 800G optical communication modules, servo drives, IoT controllers, etc. It adopts a mixed process of SMT high-density surface mount and DIP through-hole inserts, and implements the IPC-A-610 international electronic assembly standard throughout the entire process. From DFM review to aging testing, a closed-loop quality control system is established to solve the welding pain points of high difficulty boards such as thick copper plates, HDI carrier boards, ultra large size boards, and ceramic substrates.
（2） SMT SMT Chip Core Production Technology&Quality Control
1. Process flow (quality nodes)
DFM manufacturability analysis → IQC material incoming inspection → SPI solder paste thickness detection → fully automatic visual printing → high-precision module mounting → eight temperature zone nitrogen reflow soldering → AOI optical inspection → X-Ray perspective inspection → board splitting → first piece confirmation
2. Hardcore technical parameters (quality highlights)
1. Mounting accuracy: ± 0.02mm, can be used to mount 01005 miniature resistive and capacitive components BGA/QFN/QFP、 Inverted chip, shielding cover, precision connector;
2. Welding guarantee: nitrogen protection reflow soldering, thick copper plate exclusive thermal compensation furnace temperature curve, to prevent virtual soldering, cold soldering, voids, monuments, and bridging;
3. Full dimensional inspection: SPI solder paste volume control, AI-AOI defect automatic capture, X-ray penetration detection of BGA solder ball void rate, 100% interception of hidden defects;
4. Special processes: double-sided SMT, HDI arbitrary step board mounting, precision mounting of 800G optical module carrier board, and FPC mounting of soft hard bonding board.
3. Key points of SMT quality control
-Anti error scanning and traceability of electronic components, control of solder paste opening time, and regular tension testing of steel mesh;
-Retain furnace temperature curve reports, first piece samples, and original testing data for each batch;
-The repair of defective products shall follow the SOP for rework, and can only proceed to the next process after a second re inspection.
（3） Core Production Technology and Quality Control for DIP Plug in Welding
1. Process flow
Component pin shaping and trimming → automatic axial/radial insertion+manual shaped component insertion → precise soldering flux spraying → dual peak lead-free peak soldering → automatic cutting → ultrasonic cleaning → post soldering reinforcement and welding → full appearance inspection
3、 DIP through-hole plug-in soldering technology (high-power/large device reinforcement process)
For high-power power terminals, transformers, electrolytic capacitors, connectors, power MOSFETs, relays and other direct insertion components of smart devices, a combination process of * * automatic plug-in+wave soldering+post soldering repair * * is adopted to compensate for the shortcomings of SMT in carrying high current and high load components.
（1） Standard DIP process flow
Component pin shaping and trimming → automatic/manual insertion → flux spraying → double wave soldering → automatic cutting → post soldering and repair → cleaning → visual inspection of appearance
（2） Core process highlights
1. * * Plugin homework**
Large quantities are equipped with fully automatic axial/radial insertion machines, while small batches and irregular terminals are manually inserted. The positioning accuracy of the insertion is ± 0.1mm, avoiding hole misalignment and pin bending;
2. * * Dual peak lead-free wave soldering**
The dual peak structure of perturbation wave and smooth wave is optimized for thick plate and dense hole PCB to improve the board speed and solder temperature, effectively eliminating insufficient solder connection, solder coating, and virtual soldering of through-hole devices; The high-power board adopts high-temperature and heat-resistant tin bars, with high mechanical strength of solder joints and resistance to high current impact;
3. * * Post processing reinforcement**
-Automatic cutting of excess pins, ultrasonic cleaning of residual rosin on the board surface;
-Defective points are manually repaired with a constant temperature soldering iron, and connectors are reinforced with tin;
-High end intelligent devices can choose * * three proof paint spraying (acrylic/polyurethane) * *, which is moisture-proof, mildew proof, and salt spray proof, suitable for complex industrial environments.
（3） DIP Applicable Scenarios
Industrial switch power board, frequency converter drive board, charging pile power board, control cabinet IO terminal board, relay module board.
4、 SMT+DIP hybrid assembly complete PCBA full chain (Chaosheng standard delivery chain)
1. Early stage: Customer Gerber+BOM+coordinate file DFM review, optimizing panel splicing, steel mesh, and process risks;
2. Board body: self-developed PCB production, flying pin electrical on/off testing, impedance testing;
3. SMT: SMT fully automatic mounting+reflow soldering+AOI/X-Ray detection;
4. Plugin: DIP plugin → Wave soldering → Foot cutting cleaning;
5. Functional testing: ICT static on-off test → FCT whole machine power on function aging test;
6. Protection and shipment: Three proof coating, component reinforcement, label screen printing, vacuum moisture-proof packaging.
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