Contact Platform Support
Help CenterChina Rigid‑Flex FPC, Rigid‑Flex PCB, Ultra‑Long Flexible FPC, Extra Long Flex PCB, Roll‑to‑Roll R2R Flexible Printed Circuit, Large‑Format Flex PCB
Product Spotlights
Related Products
-
Wiring for Automated Machinery, Connecting Cables for New‑energy‑vehicle Power Batteries, Rail‑transit Wiring Harnesses, Large‑scale LEDNegotiableMOQ: 1 Blade -
High Pixel Camera Nickel Palladium Flexible Multi-layer FPC, HDI Flexible FPC, China Chaosheng Electronics Source FactoryNegotiableMOQ: 200 Blades
-
Computer Camera Nickel Palladium Flexible Multi-layer FPC, HDI Flexible FPC, China Chaosheng Electronics Source FactoryNegotiableMOQ: 1 Blade
-
Bank Equipment Nickel Palladium Flexible Multi-layer FPC, HDI Flexible FPC, China Chaosheng Electronics Source FactoryNegotiableMOQ: 20 Blades
-
IPhone, Apple Notebook, Computer Screen, Soft and Hard Structure, FPC Integration 12 Layer Arbitrary Soft Hard Combination HDIFPC,pcb,fpc,pcba,SMTNegotiableMOQ: 10 Units
If you have any needs, please feel free to contact China Chaosheng Electronics Company. Please contact us as follows:
whatsapp：+8613528819118
Skype live: pcb-fpcb88@163.com
E-mail : sales@chaoshengpcb-fpc.com
Contact: Mank. Li
China Chaosheng Electronics | Complete‑Set Technologies for Rigid‑Flex FPC and Ultra‑Long Flexible FPC
I. Core Technologies of Rigid‑Flex FPC
1. Substrate Configuration
1. Flexible zones: Adhesiveless DuPont PI (polyimide) substrates and rolled‑annealed copper foil, supporting over 200,000 cycles of shaft bending fatigue tests.
2. Rigid zones: High‑Tg FR‑4 rigid‑board substrates. Low‑stress DuPont adhesive films are adopted at rigid‑flex junctions to prevent soft‑zone hardening failure caused by adhesive overflow.
3. Optional adhesiveless PI substrates and high‑frequency LCP substrates for 800G optical modules and high‑speed signal scenarios. ### 2. Core Manufacturing Processes
1. Segmented vacuum stepped lamination process Low‑pressure air exhaust → constant‑temperature primary lamination → controlled slow cooling. Symmetric board stacking and anti‑deformation fixtures are applied to eliminate warpage, layer offset and delamination triggered by the differing thermal expansion coefficients of PI and FR‑4 materials.
2. Laser depth‑controlled windowing technology Laser depth‑fixed milling creates pure‑PI flexible windows while rigid load‑bearing areas remain intact. Inner flexible circuits stay undamaged for snag‑free bending of flexible sections.
3. Any‑layer HDI blind‑buried via fabrication Laser micro‑via drilling, resin via‑plugging and fine‑line etching deliver a minimum line width of 0.05 mm and enable high‑density interconnection between rigid and flexible zones.
4. Surface finishing processes ENIG (electroless nickel immersion gold), hard gold plating, OSP and immersion‑silver finishes. Flexible circuits are covered with DuPont PI cover‑films to avoid plating‑layer cracking during bending.
5. Forming process: Laser cutting and precision die‑cutting prevent micro‑cracks along flexible‑board edges.
3. Product Performance Specifications - Layer count: 2‑ to 14‑layer multi‑layer rigid‑flex boards and any‑layer HDI rigid‑flex FPC - Dynamic bending lifespan: ≥ 200,000 bending cycles - Customizable controlled impedance and EMI shielding layers; component SMT mounting available on rigid sections
4. Application Scenarios 800G optical modules, new‑energy‑vehicle electronic control units, foldable‑screen hinges, medical equipment, industrial controllers and internal wiring for AI servers ## II. Core Technologies of Ultra‑Large‑Size Ultra‑Long Flexible FPC Chaosheng Electronics specializes in meter‑grade ultra‑long flexible circuits. Custom integrated 1–15 m flexible PCBs resolve common drawbacks of traditional wiring harnesses, including cumbersome routing, signal attenuation and connector‑related failures. ### 1. Substrate Technology High‑elongation, bend‑resistant PI substrates with rolled‑annealed copper foil and tensile‑resistant cover‑films. Whole‑sheet long‑size substrate cutting removes signal breakpoints brought by multi‑segment splicing.
2. Dedicated Process Challenges & Countermeasures 1. Roll‑to‑Roll (R2R) continuous production process Continuous coating, etching, drilling and cover‑film lamination for lengthy panels guarantee consistent line width, line spacing and copper thickness across the whole board and avert remote‑end voltage drop and impedance deviation.
2. Full‑process tension control Constant‑tension conveyance throughout every working procedure protects long flexible panels from tensile deformation, stretched copper foil and displaced pads.
3. Anti‑interference design for lengthy traces Zoned ground shielding layers, differential‑impedance routing and noise‑reduced layouts suppress electromagnetic interference over extended circuit traces.
4. Precision forming and inspection Automatic continuity testing, impedance verification and bending‑endurance inspection for ultra‑long FPCs. Integrated forming for L‑shaped and strip‑shaped profiles eliminates the requirement for intermediate adapters. ### 3. Specification Parameters - Maximum processable length: 15,000 mm (15 meters); mass‑produced standard lengths cover 1–4 m
ultra‑long FPC - Available structures: Single‑sided, double‑sided and multi‑layer flexible printed circuits ### 4. Applicable Fields Wiring for automated machinery, connecting cables for new‑energy‑vehicle power batteries, rail‑transit wiring harnesses, large‑scale LED displays, large‑format medical apparatus and internal wiring of photovoltaic equipment
Send Inquiry to This Supplier
You May Also Like
-
IPhone, Apple Notebook, Soft and Hard Structure, FPC Integration 12 Layer Arbitrary Soft Hard Combination HDI Flexible FPC,multi-layer Flexible HDIFPCNegotiableMOQ: 10 Units
-
6L High-speed Rail Car High-voltage Soft Hard Combination FPC,PCB,FPC,PCBA,SMT，China Chaosheng Electronics High Speed Railway Main Board PCBNegotiableMOQ: 1 Unit
-
12 Layer 3-level Soft Hard Combination Multi-layer FPCNegotiableMOQ: 20 Units
-
12 Layers, 3rd Order Soft and Hard Combination FPC,Soft Hard Combination FPCNegotiableMOQ: 20 Units
-
8 Layers, 2nd Order Soft Hard Combination FPCNegotiableMOQ: 10 Units
-
6 Layers, 3rd Order Soft Hard Combination FPC,COB Soft Hard Combination FPCNegotiableMOQ: 200 Units
-
4 Layers, 2rd Order Soft Hard Combination FPCNegotiableMOQ: 200 Units
-
54 Layer Soft Hard Composite Layered Board Military Product，54 Layer Soft Hard Combination Layered FPCNegotiableMOQ: 10 Units
-
26 Layers of HDI Laminated Board With a Combination of Soft and Hard MaterialsPCBNegotiableMOQ: 10 Units
-
Layers: 6 Layers, 2nd Order Soft Hard Combination HDIFPC,NegotiableMOQ: 200 Units
