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Chaosheng computer board/graphics card/memory module PCB circuit board and gold finger thickened electroplating core technologyess of up to 1-50 μ ". High end gaming graphics cards and server memory can be customized to be thickened to over 100 μ", with a hardness of HV130-200, far exceeding ordinary electroplating metal processes. The high-purity gold plating layer (purity ≥ 99.9%) has ultimate conductivity, oxidation resistance, and wear resistance, and can withstand more than 500 repeated insertions and removals. It does not oxidize, blacken, or corrode in long-term high temperature and high load environments, continuously ensuring high-speed signal transmission without damage, completely solving hardware contact problems, frame drops, memory errors, and machine lagging caused by metal finger oxidation and wear.
3. Complete electroplating process flow
Cleaning and degreasing of the board surface → acid pickling and micro corrosion roughening → pre immersion activation → selective masking → electroplating of thickened nickel layer → water washing purification → electroplating of thickened hard gold layer → multi-stage cleaning with pure water → drying and curing → edge chamfering detection → impedance and wear resistance testing, with precise control throughout the process to ensure uniform coating thickness, strong adhesion, no pinholes, and no delamination defects.
4、 Core technological advantages (solving the core pain points of computer lag)
High speed signal stability: The thickened nickel gold coating has extremely low impedance and high consistency, with no signal attenuation or crosstalk. It is compatible with DDR5 and PCIe 5.0 high-speed transmission, eliminating problems such as frame drop, memory read/write lag, and data loss in graphics cards.
Super wear-resistant and wear-resistant: The hard gold alloy coating has high hardness and can withstand frequent disassembly, chassis vibration, and long-term insertion and removal wear. The contacts are not easily deformed and worn, and the long-term use provides stable contact.
Ultimate oxidation and corrosion resistance: The dense nickel gold double-layer structure isolates air, water vapor, and dust, preventing the oxidation, blackening, and rusting of gold fingers, and avoiding blue screens, crashes, and overall machine lagging caused by poor contact.
High temperature resistance and aging resistance: adapt to the high load and high temperature working environment of the graphics card and memory, the coating will not soften, fall off, or age, and the long-term stable operation will extend the service life of the board.
Excellent conductivity performance: Strong high current conductivity, stable power supply, and elimination of hardware frequency reduction, lagging, and restart failures caused by power supply fluctuations.
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