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Help CenterChaoSheng Electronics — Mini‑LED HDI Multi‑Layer PCB for Ultra HD Television Version: Export Sales Copy | For TV Brand, Module Maker
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1. Executive Summary
ChaoSheng Electronics, based in China with manufacturing bases in Shenzhen and Jiangxi, specializes in high‑end HDI multi‑layer PCBs for premium Mini‑LED ultra‑high‑definition televisions. Our Mini‑LED HDI boards are engineered to solve core pain points of Mini‑LED backlight systems: ultra‑fine pad density, zone‑by‑zone local dimming control, signal integrity, thermal dissipation, brightness uniformity and halo suppression. This document highlights our core technical strengths, quality advantages, target customer positioning and promotion roadmap to win global display OEM/ODM, backlight module and TV brand customers.
2. Product Introduction
Our Mini‑LED HDI multi‑layer PCB serves as the core carrier of Mini‑LED backlight for 4K / 8K UHD TVs. It adopts advanced HDI microvia stacking structure, ultra‑fine circuit fabrication and high‑reflectivity optical solder mask. It supports massive independent dimming zones, precise constant‑current driving and stable long‑time operation, enabling TV terminals to deliver deeper black levels, higher contrast ratio, uniform brightness and richer HDR image performance.
3. Core Technical Advantages
1. Advanced Multi‑Order HDI Microvia Technology
We support 1st‑order to 4th‑order HDI, laser microvias, via‑in‑pad and filled‑via process. Ultra‑small pads match tiny Mini‑LED chips, which greatly increases layout density and realizes thousands of local dimming zones on one backlight board. This architecture separates power layers, signal layers and ground layers independently, reducing crosstalk and guarantee consistent driving signal for every LED zone, the foundation of fine‑grayscale HDR control.
2. Ultra‑Fine Line & Precision Registration Capability
Minimum line width / line space down to 25–30μm, high‑precision layer alignment. Suitable for high‑density Mini‑LED array layout. It avoids open/short risk in dense circuits and supports large‑size TV backlight panels with uniform pixel distribution, effectively reducing light blooming and halo effect around bright objects.
3. Optimized Thermal Management Stack‑up Design
Custom high‑TG low‑CTE laminate, reasonable thick‑copper power layer design. Heat generated by dense Mini‑LED chips spreads quickly through copper layers and thermal vias. It prevents thermal drift of LED wavelength and brightness decay, keeping color consistency across the whole screen under long‑hour high‑brightness working mode.
4. Optical‑Tuned White Solder Mask Process
High reflectivity, low light‑absorption white solder mask is specially selected for Mini‑LED backlight. It improves light efficiency, boosts screen brightness and ensures excellent brightness uniformity, eliminating mottle and dark zones, which directly upgrades the optical performance of the whole Mini‑LED TV module.
5. Stable High‑Speed & High‑Current Driving Compatibility
Balanced impedance control for scan lines and data lines. Stable transmission under high refresh rate and large current driving. Compatible with mainstream Mini‑LED IC drivers for 4K / 8K UHD TV backlight architecture.
6. Large‑Format HDI Mass Production Capacity
Our Jiangxi factory is equipped with large‑panel HDI production lines, capable of oversized PCB for big‑screen Mini‑LED TVs (75”, 85”, 98” and above). Integrated one‑stop production from CAM design, lamination, laser drilling, plating, AOI, electrical test to final inspection.
4. Quality & Reliability Advantages
1. Strict IPC Class‑3 High‑Reliability Standard
All boards follow IPC‑6012 Class 3 criteria. Full traceability of raw materials, production parameters and test records. Raw laminates, copper foil, solder mask and surface finish are sourced from well‑known high‑end material suppliers.
2. Complete Validation & Reliability Test Laboratory
In‑house lab runs thermal shock, thermal cycling, humidity aging, reflow simulation, solderability, insulation resistance and CAF resistance tests. Boards pass long‑term high‑temperature & high‑humidity aging to adapt global TV market working environments.
3. Advanced Multi‑Stage AOI + Flying‑Probe E‑Test
Ultra‑fine circuit AOI inspection + flying probe electrical test for every panel. Auto screening for micro open, micro short, pad defect and impedance deviation. Greatly reduce hidden defects for ultra‑dense Mini‑LED circuits, improving final module yield.
4. Controlled Surface Finish Options
ENIG, ENEPIG, OSP are available. Flat, clean pad surface ensures stable solder joint for tiny Mini‑LED chips, preventing cold solder, voids and oxidation during SMT and storage.
5. Low DPPM Delivery & Stable Mass Production Yield
Mature HDI process accumulated from years of display PCB delivery. Stable yield for high‑density Mini‑LED boards, helping customers cut rework cost and shorten module production cycle.
6. Full Compliance Certification
ISO9001, ISO14001, IATF16949 (optional), RoHS, REACH. Meet the regulatory requirements of EU, North America and other mainstream export markets.
5. Target Market & Customer
• Global Mini‑LED TV brands
• Backlight module manufacturers for UHD television
• Display solution design houses
• ODM/OEM TV manufacturers focusing on high‑end 4K / 8K premium models
6. Marketing & Sales Strategy
1. Technical Marketing
Release technical brief, stack‑up samples, reliability test reports and side‑by‑side optical comparison data (halo, uniformity, brightness consistency). Provide early DFM co‑design service together with customer optical and electronic teams at project NPI stage.
2. Sample & Roadshow Promotion
Offer engineering samples for new model verification; attend global display exhibitions, send technical datasheets to overseas purchasing and R&D teams via email & LinkedIn.
3. Supply‑Chain Positioning
Position ChaoSheng as a trusted China high‑end HDI PCB supplier dedicated to Mini‑LED TV backlight, highlighting large‑size HDI mass production advantage and fast NPI turnaround.
4. After‑Sales Technical Support
Assign dedicated FAE for overseas customers; support failure analysis, process adjustment and rapid change revision during mass production ramp‑up.
7. Competitive Differentiator
Many HDI factories focus on mobile or consumer boards; ChaoSheng focuses on display‑oriented HDI optimization. We do not only make dense lines, but tune the whole PCB stack, solder mask optical property and thermal design specifically for Mini‑LED backlight TV’s optical and image requirements.
8. Contact
ChaoSheng Electronics (China)
Shenzhen / Jiangxi Production Base
Email: sales@chaoshengpcb-fpc.com
Website: http://www.jxchaoshengpcb-fpc.com
Website: http://www.chaoshengpcb-fpc.com
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