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#China Chaosheng Group Intelligent Equipment PCBA Full Process (SMT+DIP) Production Technology Solution
China Chaosheng Group (main body: Hong Kong Chaosheng Group, Shenzhen Chaosheng Electronics) relies on its own * * high-end PCB/FPC self-developed production capacity * * (16 layer thick copper plate, ultra large size board, aluminum/ceramic substrate, HDI arbitrary order), supporting a full chain intelligent PCBA assembly production line, specializing in * * industrial intelligent equipment, new energy electronic control, optical module communication equipment, automation controller * * circuit board one-stop SMT, plug-in, soldering and reliability testing, SMT high-density mounting+DIP high-power through-hole plug-in as the two core process systems.
1、 Prerequisite: PCB self-developed supporting capability (PCBA underlying support)
The biggest advantage of Chaosheng PCBA is the integration of * * board factory and assembly factory * *, which can directly match the high difficulty board requirements of intelligent devices:
1. Board specifications: up to 16 layers PCB, thick copper and gold, ultra long and ultra large size board (up to 2000mm ultra long circuit board), FR-4 high TG board, aluminum substrate, 96% alumina ceramic substrate, FPC flexible board, soft hard bonding board;
2. Precision circuit: LDI laser direct writing, minimum line width and spacing of 3/3mil, minimum aperture of 0.15mm, impedance controllable ± 10%;
3. Surface technology: sinking gold, thick gold OSP、 Sinking and spraying tin, compatible with SMT micro component soldering reliability;
4. Application base plate: intelligent control cabinet motherboard, servo drive board, industrial gateway, 800G optical module carrier board, charging pile power board.
2、 SMT surface mount core technology (high-density precision device assembly)
（1） Complete standard process flow
DFM manufacturability review → fully automated solder paste printing → high-speed and high-precision mounting → reflow soldering → AOI visual inspection → X-Ray perspective inspection → board splitting
（2） Key process parameters and intelligent configuration
1. Solder paste printing**
Fully automatic visual steel mesh printing machine, supporting 01005 micro resistive capacitive components, BGA/QFN chip window opening, closed-loop detection of solder paste thickness, to prevent insufficient solder, continuous solder, and offset; Lead free and environmentally friendly solder paste meets the RoHS requirements for industrial equipment.
2. * * High speed mounting (core production capacity)**
-Equipment: Imported high-speed module placement machine, * * mounting accuracy ± 0.02mm * *;
-Devices that can be attached: 01005 micro components, BGA, QFP, QFN, DDR connectors, shielding covers, precision inductors;
-Capacity: 12000 points per hour for a single machine, 24-hour uninterrupted production for a dual track production line, supporting double-sided SMT mounting;
-Special abilities: Precise pressing and mounting of irregular structural components, shielding frames, and thermal pads.
3. Reflow soldering**
Eight temperature zone full hot air reflux furnace, temperature control curve with precise adjustable temperature zones, providing thermal compensation for thick copper plates and large heat absorbing plates, solving the problems of cold welding and virtual welding caused by uneven heat absorption of thick plates; Nitrogen protection reflux is optional to improve the density of BGA solder joints and meet the high reliability requirements of communication and industrial control.
3、 DIP through-hole plug-in soldering technology (high-power/large device reinforcement process)
For high-power power terminals, transformers, electrolytic capacitors, connectors, power MOSFETs, relays and other direct insertion components of smart devices, a combination process of * * automatic plug-in+wave soldering+post soldering repair * * is adopted to compensate for the shortcomings of SMT in carrying high current and high load components.
（1） Standard DIP process flow
Component pin shaping and trimming → automatic/manual insertion → flux spraying → double wave soldering → automatic cutting → post soldering and repair → cleaning → visual inspection of appearance
（2） Core process highlights
1. * * Plugin homework**
Large quantities are equipped with fully automatic axial/radial insertion machines, while small batches and irregular terminals are manually inserted. The positioning accuracy of the insertion is ± 0.1mm, avoiding hole misalignment and pin bending;
2. * * Dual peak lead-free wave soldering**
The dual peak structure of perturbation wave and smooth wave is optimized for thick plate and dense hole PCB to improve the board speed and solder temperature, effectively eliminating insufficient solder connection, solder coating, and virtual soldering of through-hole devices; The high-power board adopts high-temperature and heat-resistant tin bars, with high mechanical strength of solder joints and resistance to high current impact;
3. * * Post processing reinforcement**
-Automatic cutting of excess pins, ultrasonic cleaning of residual rosin on the board surface;
-Defective points are manually repaired with a constant temperature soldering iron, and connectors are reinforced with tin;
-High end intelligent devices can choose * * three proof paint spraying (acrylic/polyurethane) * *, which is moisture-proof, mildew proof, and salt spray proof, suitable for complex industrial environments.
（3） DIP Applicable Scenarios
Industrial switch power board, frequency converter drive board, charging pile power board, control cabinet IO terminal board, relay module board.
4、 SMT+DIP hybrid assembly complete PCBA full chain (Chaosheng standard delivery chain)
1. Early stage: Customer Gerber+BOM+coordinate file DFM review, optimizing panel splicing, steel mesh, and process risks;
2. Board body: self-developed PCB production, flying pin electrical on/off testing, impedance testing;
3. SMT: SMT fully automatic mounting+reflow soldering+AOI/X-Ray detection;
4. Plugin: DIP plugin → Wave soldering → Foot cutting cleaning;
5. Functional testing: ICT static on-off test → FCT whole machine power on function aging test;
6. Protection and shipment: Three proof coating, component reinforcement, label screen printing, vacuum moisture-proof packaging.
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