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Help CenterBokeli Mold Release Agent for Copper-clad Laminate, Circuit Board, and Insulating Board
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ucb-60 is a mold release agent specifically designed for the metal mold compression molding process of copper-clad laminates, circuit boards, and insulating material boards made from epoxy prepreg (semi-cured sheets). It is a homogeneous mixture system of low molecular weight nano-new materials and environmentally friendly halogen-free solvents. Advantages Smooth demolding with no mold buildup. Allows multiple demolding cycles without affecting post-processing. The product surface has good gloss. Odorless and pollution-free Application Before use, clean the mold surface and ensure it is dry. If other types of release agents have been used on the mold surface, clean the mold thoroughly with a cleaning agent. Note: Clean the mold in a well-ventilated area. 1 Use a clean, dry cotton cloth to soak up ucb-60 and apply it evenly to the entire mold surface, leaving no areas missed. 2 It can be used immediately after application, or production can begin after drying for 3-10 minutes Note: For newly used or freshly cleaned molds, apply 2 layers. This release agent allows for multiple demolding cycles. The frequency of applying the release agent depends on the specific process conditions Important Notes 1 Cover the lid immediately after use, and do not mix with other products or solvents 2 During multiple demolding operations, if demolding becomes difficult, apply an additional layer of release agent 3 When the process only requires a single demolding, apply the release agent and demold immediately
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